• Assembly of chips into premold packages of plastics

  • Assembly of chips into premold packages of ceramic

Premold Packages (Open Cavity)

Ceramic packages

ceramic package with bonded chip

We offer the assembly of Your DIE's into most different package variants of ceramic. Packages  can be sealed with a corresponding cover plate.

Plastic packages

premold package made of plastics

We offer the assembly of Your DIE's into most different package variants of plastics. Packages  can be sealed with a corresponding cover plate or with Glob-Top.

MAF
Microelectronic Assembly Frankfurt (Oder) GmbH
Otto-Hahn-Straße 24
15236 Frankfurt (Oder)

Phone:  +49 335 3871963
Fax:       +49 335 3871964

Mail:      info@maf-ffo.com

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