• SOP-package still in an carrier substrate after molding

  • The great variety of FOQ packages and FOD packages

Standard Packages

Package variants

We provide you with a wide range of possible package types for the assembly of DIE's (SOP, SSOP, PQFP, QFN, DFN). All package variants are compiled in our product catalog as PDF.

Small Outline Package (SOP 150 mil und 300 mil)

We furthermore offer the assembly into a large number of different SOP standard packages.

Variants with 150 mil: 08 L, 14 L, 16 Ln (Jedec MS-012)
Variants with 300 mil: 18 L, 20 L, 28 L (Jedec MS-013)

Mechanical data of package variants

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Small Outline Package (SOP 300 mil)

Variants with 300 mil: 12LP

Mechanical data of package variants
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Small Outline Package (SOP 300 mil)

Variants with 300 mil: 10LP, 20LP

Remark: A power dissipation of up to 1.5 watt can be realized.

Mechanical data of package variants
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Plastic Quad Flat Package (PQFP) - JEDEC MS-022

Variants: PQFP 64, 80, 100 (Body: 14 x 20)

Mechanical data of package variants
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Shrink Small Outline Package (SSOP) - JEDEC MO-137

Variants: SSOP 16, SSOP 20, SSOP 24, SSOP 28

Mechanical data of package variants

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Assembly into a standard package (QFN and DFN)

QFN:

Variation: QFN18, QFN24, QFN32, QFN40, QFN48, QFN56, QFN64, QFN80
Remark: conforms to JEDEC MO-220

FOD:

Variation: DFN10, DFN18
Remark: conforms to JEDEC MO-229

Mechanical data of package variants

Weniger…

Electrical test

Test Your wafers or electronic components at HTV GmbH.

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MAF
Microelectronic Assembly Frankfurt (Oder) GmbH
Otto-Hahn-Straße 24
15236 Frankfurt (Oder)

Phone:  +49 335 3871963
Fax:       +49 335 3871964
E-mail:   maf@maf-ffo.de

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