• Chip on board

    Do you also consider the bonding of chips directly onto the printed circuit board ?

Chip on Board (COB)

Bonding of DIE's directly onto a printed cirucit board

The DIE's are bonded directly onto a printed circuit board and covered with Glob-Top (e. g. FR4).

Electrical test

Test Your wafers or electronic components at HTV GmbH.

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MAF
Microelectronic Assembly Frankfurt (Oder) GmbH
Otto-Hahn-Straße 24
15236 Frankfurt (Oder)

Phone:  +49 335 3871963
Fax:       +49 335 3871964
E-mail:   maf@maf-ffo.de

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