Do you also consider the bonding of chips directly onto the printed circuit board ?
Chip on Board (COB)
The DIE's are bonded directly onto a printed circuit board and covered with Glob-Top (e. g. FR4).
Test Your wafers or electronic components at HTV GmbH.
MAF Microelectronic Assembly Frankfurt (Oder) GmbHOtto-Hahn-Straße 2415236 Frankfurt (Oder)
Phone: +49 335 3871963Fax: +49 335 3871964E-mail: firstname.lastname@example.org