• Different special packages are also on offer

Special Packages

Several DIE's in one package (SIP - system in package)

several chips in a package (SIP) several DIE's in one package (SIP)

Due to the flexible design of the leadframe it is possible to integrate several DIE's and passive components in one package.

Transparent packages

transparent package transparent package

For optical applications (e. g. color sensors, LED-DIE's and photo transistors) we manufacture packages with transparent plastics. These packages are optimized for different wavelengths. 

LED chips in transparent package
LED-DIE's in transparent package

Dummies (empty packages)

empty package for contact test X-ray image: dummy package

For the early examination of electrical and mechanical functionality of contact pins at your test system we would be glad to assist you with the production of dummy packages. For the simple contact examination any desired pins can, according to customer specifications, be electrically connected to the dummy.

Microelectronic Assembly Frankfurt (Oder) GmbH
Otto-Hahn-Straße 24
15236 Frankfurt (Oder)

Phone:  +49 335 3871963
Fax:       +49 335 3871964

Mail:      info@maf-ffo.com