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Quality

Quality control

Between the individual production steps visual spot-checks were performed on the products. The bonding process is monitored via pull and shear tests. Process stability is controlled with Statistical Process Control (SPC).

MAF
Microelectronic Assembly Frankfurt (Oder) GmbH
Otto-Hahn-Straße 24
15236 Frankfurt (Oder)

Phone:  +49 335 3871963
Fax:       +49 335 3871964

Mail:      info@maf-ffo.com

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