• MAF offers sawing and waffle-pack for Your wafers

Wafer: Abrasive Cutting & Waffle-Pack

Wafer lamination

undefined stretched wafer

In the first step the delivered wafers are glued onto an elastic adhesive layer with which a secure processing of the wafers is possible during the subsequent process steps. Based on customer's request we redeliver the stretched, sawed wafers directly to the customer for further processing,

Wafer - Abrasive Cutting (Dicing)

undefined sawed wafer

In the second process step, the wafer is sawed with high-precision. DIE's are subsequently separated from one another and can be further processed. Wafer maps can also be processed by us.

DIE-Sorting - Waffle-Pack

undefined Waffle with picked DIE's

The separated DIE's are picked up from the foil by a handling system and inserted into a waffle-pack. In this regard, please also consider our delivery times.

Other Services

  • Backgrinding of wafers is performed by our partners.
  • On request DIE's can be packed in provided gel-packs.

Electrical test

Test Your wafers or electronic components at HTV GmbH.

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MAF
Microelectronic Assembly Frankfurt (Oder) GmbH
Otto-Hahn-Straße 24
15236 Frankfurt (Oder)

Phone:  +49 335 3871963
Fax:       +49 335 3871964
E-mail:   maf@maf-ffo.de

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