We furthermore offer the assembly into a large number of different SOP standard packages.
Variants with 150 mil: 08 L, 14 L, 16 Ln (Jedec MS-012)
Variants with 300 mil: 18 L, 20 L, 28 L (Jedec MS-013)
We provide you with a wide range of possible package types for the assembly of chips (SOP, SSOP, QFP). All package variants are compiled in our product catalog as PDF.