SOP-package still in an carrier substrate after molding

The great variety of FOQ packages and FOD packages

Standard packages

Package variants

We provide you with a wide range of possible package types for the assembly of chips (SOP, SSOP, QFP). All package variants are compiled in our product catalog as PDF.

Small Outline Package (SOP 150 mil und 300 mil)

We furthermore offer the assembly into a large number of different SOP standard packages.

Variants with 150 mil: 08 L, 14 L, 16 Ln (Jedec MS-012)
Variants with 300 mil: 18 L, 20 L, 28 L (Jedec MS-013)

Mechanical data of package variants

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Small Outline Package (SOP 300 mil)

Variants with 300 mil: 12LP

Mechanical data of package variants
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Small Outline Package (SOP 300 mil)

Variants with 300 mil: 10LP, 20LP

Remark: A power dissipation of up to 1.5 watt can be realized.

Mechanical data of package variants
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Plastic Quad Flat Package (PQFP) - JEDEC MS-022

Variants: PQFP 64, 80, 100 (Body: 14 x 20)

Mechanical data of package variants
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Shrink Small Outline Package (SSOP) - JEDEC MO-137

Variants: SSOP 16, SSOP 20, SSOP 24, SSOP 28

Mechanical data of package variants

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Assembly into a standard package (FOQ UND FOD)

component in FOQ package

FOQ:
Remark: conforms to QFN according to JEDEC MO-220

FOD:
Remark: conforms to DFN according to JEDEC MO-229

Mechanical data of package variants

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