For over 15 years our company offers a competent service at the highest level in the fields of packaging of integrated circuits. We provide comprehensive services from wafer sawing via bonding of dies through to the readily housed component. Chip-on-Board assembly and Multi-Chip assembly as well as Waffle-Pack also belong to the procedures offered just as sample production of premold packages, supplemented by laser marking of components and tinning of component pins.
Our company collaborates closely with semiconductor manufacturers, design houses and test houses as well as with electronics companies and semiconductor users. For our customers we find individual solutions according to the requirements.
We offer fast and flexible services in support of your ASIC-development.
Our production line is optimized for small (1.000) and medium (100.000) quantities.
For test series and small series we perform the bonding of your integrated circuits into open ceramic packages and premold packages.
Due to the registered business address in Frankfurt (Oder) we reduce your delivery times and development periods.
Also problems in terms of customs and logistics as well as language barriers are a thing of the past.
Consistent high quality is provided on the basis of our regular quality controls.
> September 2013: New web presence
> 2007: Acquisition of MAF Microelectronic Assembly Frankfurt (Oder) GmbH by company HTV GmbH in Bensheim
> March 5th, 1998: Foundation of MAF Microelectronic Assembly Frankfurt (Oder) GmbH
>1997: Insolvency proceeding of SMI
>1993: Partial privatization to the new company SMI and assembly cooperation, inter alia, with Philips Hamburg
>1989: With approximately 8000 employees Semiconductor Plant Frankfurt (Oder) produces 110 million IC's per year