Chip on board (COB)

Chip on board

Do you also consider the bonding of chips directly onto the printed circuit board ?

Chip on Board (COB)

Bonding of DIE's directly onto a printed cirucit board

The DIE's are bonded directly onto a printed circuit board and covered with Glob-Top (e. g. FR4).

MAF
Microelectronic Assembly Frankfurt (Oder) GmbH
Otto-Hahn-Straße 24
15236 Frankfurt (Oder)

Phone: +49 335 3871963
Fax: +49 335 3871964