Our services and technologies for your progress

Welcome to MAF Microelectronic Assembly Frankfurt (Oder) GmbH

For over 15 years MAF Microelectronic Assembly Frankfurt (Oder) GmbH is a specialist and competent service partner at the highest stage for the assembly of microelectronic circuits. From wafer sawing via bonding of dies through to ready housed components we provide extensive services to you.

We will be happy to advise you on the choice of a suitable package for your particular application. Production is especially tailored to your needs, thus providing a unique selling proposition and a maximum flexibility for your ASIC development.

Chip-on-Board assembly and Multi-Chip assembly as well as Waffle-Pack also belong to the procedures offered just as sample production of premold packages, supplemented by laser marking of components and tinning of component pins.

ICs with most diverse standard packages and special packages with a freely selectable pinout can be assembled in our company. Possible variants of standard packages include, inter alia: SOP, SSOP, QFP, FOQ, FOD.

stretched wafer
leadframe
sawed wafer
glue droplets on leadframe
wire bonding: chips - leadframe
pull test
ceramic package with bonded chip
molded leadframe
marking with laser
leadframe after tinning
bending and isolation
components in tube
empty package for contact test
components in leadframe
component in FOQ package
transparent package
several chips in a package (SIP)
LED chips in transparent package
waffle pack

MAF Microelectronic Assembly Frankfurt (Oder) GmbH

Otto-Hahn-Straße 24
15236 Frankfurt (Oder)
Germany

Phone: +49 335 3871963
Fax: +49 335 3871964
E-Mail: maf@maf-ffo.de

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