• MAF - Together one step ahead!

Certification and Quality

Quality control

Between the individual production steps visual spot-checks were performed on the products. The bonding process is monitored via pull and shear tests. Process stability is controlled with Statistical Process Control (SPC).


undefined ISO-Certificate

Processes of our company are certified according to DIN EN ISO 9001:2015.

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Microelectronic Assembly Frankfurt (Oder) GmbH
Otto-Hahn-Straße 24
15236 Frankfurt (Oder)

Phone:  +49 335 3871963
Fax:       +49 335 3871964